Established in 1981, DFI is a leading manufacturer of high-performance computing technology worldwide. With more than 33 years of experience, DFI focuses on innovative design and manufacture of leading-edge board and system level products for embedded applications requiring strict revision control and long life availability. DFI produces the following products: DFI, IPC manufacturer, Embedded Computer, Embedded Motherboard, Industrial Computer, Industrial PC, Industrial system, Embedded Motherboard, ODM, OEM, Custom board, Intel, Haswell, Bay Trail, Intel Atom, Intel Core, AMD, ARM, Freescale, Industrial Motherboard, ATX, microATX, Mini ITX, Computer on module, COM Express, Qseven, SBC, Embedded System, Embedded PC, Chassis, Panel PC, TPC, Open frame, Industrial Monitor, Graphics card, riser card, Intel AMT, Desktop, Workstation, Mobile, Ultra, Server grade, Industrial Automation, Factory Automation, POS, ATM, KIOSK, Medical, Gaming, In-vehicle PC, Car PC, HMI, Smart grid, server, controller, IoT and Internet of Thing. DFI uses the latest technology platforms and manufacturing techniques to produce cost-effective products for use in medical diagnostic & imaging, ATM/POS, industrial control, kiosk, security & surveillance, digital signage, gaming, and other embedded applications. As an Associate member of the Intel Internet of Things Solutions Alliance, DFI works closely with Intel on development of next-generation standards-based building blocks, platforms and solutions for the communications and embedded market segments. For more information, please feel free to contact us.

DFI, IPC manufacturer, Embedded Computer, Embedded Motherboard, Industrial Computer, Industrial PC, Industrial system, Embedded Motherboard, ODM, OEM, Custom board, Intel, Haswell, Bay Trail, Intel Atom, Intel Core, AMD, ARM, Freescale, Industrial Motherboard, ATX, microATX, Mini ITX, Computer on module, COM Express, Qseven, SBC, Embedded System, Embedded PC, Chassis, Panel PC, TPC, Open frame, Industrial Monitor, Graphics card, riser card, Intel AMT, Desktop, Workstation, Mobile, Ultra, Server grade, Industrial Automation, Factory Automation, POS, ATM, KIOSK, Medical, Gaming, In-vehicle PC, Car PC, HMI, Smart grid, server, controller, IoT and Internet of Thing.



HR900-B COM Express

HR900-B



Status: Released

7 Years CPU Life Cycle Support
Features
Processor 3rd Gen Intel® Core™
2nd Gen Intel® Core™
Chipset Intel® QM67
Memory 2 DDR3 SODIMM up to 16GB
Expansion 1 PCIe x16
5 PCIe x1

4 PCI

1 LPC

1 SMBus

8 USB 2.0

8-bit DIO

1 LAN
Display 1 VGA
1 LVDS

2 DDI (HDMI/DP/SDVO)
Storage 2 SATA 3.0
2 SATA 2.0

1 IDE
Compliance COM Express Basic R1.0, Type 2
Dimensions 95mm x 125mm
Certification CE FCC RoHS MB-UL





Specifications Package List/Ordering Information Downloads
 
PROCESSOR
  • Socket G2 988B for:
    - 3rd Generation Intel® Core™ processors
      (22nm process technology)
      : Intel® Core™ i7-3610QE (6M Cache, up to 3.3 GHz); 45W
      : Intel® Core™ i5-3610ME (3M Cache, up to 3.3 GHz); 35W
      : Intel® Core™ i3-3120ME (3M Cache, 2.4 GHz); 35W
    - 2nd Generation Intel® Core™ processors
      (32nm process;technology)
      : Intel® Core™ i7-2710QE (6M Cache, up to 3.0 GHz); 45W
      : Intel® Core™ i5-2510E (3M Cache, up to 3.1 GHz); 35W
      : Intel® Core™ i3-2330E (3M Cache, 2.2 GHz); 35W
      : Intel® Celeron® B810 (2M Cache, 1.6 GHz); 35W
  • Intel® Advanced Vector Extensions (Intel® AVX) Instructions
  • Intel® Turbo Boost Technology
  •  
     
    CHIPSET
  • Intel® QM67 Express Chipset
  •  
     
    SYSTEM MEMORY
  • Two 204-pin DDR3 SODIMM sockets
  • Supports DDR3 1066/1333MHz
  • Supports dual channel memory interface
  • Supports up to 16GB system memory
  • DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3 DRAM technologies are supported for x8 and x16
    devices, unbuffered, non-ECC
  •  
     
    ONBOARD GRAPHICS FEATURES
  • Intel® HD Graphics 4000 (3rd generation processors)
  • Intel® HD Graphics 3000 (2nd generation processors)
  • Intel® HD Graphics (Intel® Celeron® processors)
  • Supports VGA, LVDS and DDI interfaces
  • VGA: resolution up to 2048x1536 @ 75Hz
  • LVDS: Single Channel - 18/24-bit; Dual Channel - 36/48-bit, resolution up to 1920x1200 @ 60Hz
  • Digital Display Interfaces: HDMI, DP and SDVO (for Port B)
  • HDMI, DP: resolution up to 1920x1200 @ 60Hz
  • Supports 6 or 16 Graphics Execution Units (EUs)
    (3rd generation processors)
  • Supports 6 or 12 Graphics Execution Units (EUs)
    (2nd generation processors)
  • Intel® Clear Video Technology
  • DirectX Video Acceleration (DXVA) support for accelerating video processing
  • Supports DirectX 11/10.1/10/9 and OpenGL 3.0
    (3rd generation processors)
  • Supports DirectX 10.1/10/9 and OpenGL 3.0
    (2nd generation processors)
  •  
     
    ONBOARD AUDIO FEATURES
  • Supports High Definition Audio interface
  •  
     
    ONBOARD LAN FEATURES
  • Intel® 82579LM Gigabit Ethernet PHY
  • Integrated 10/100/1000 transceiver
  • Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
  •  
     
    SERIAL ATA (SATA) INTERFACE
  • Supports 4 Serial ATA interfaces
  • 2 SATA 2.0 with data transfer rate up to 3Gb/s
  • 2 SATA 3.0 with data transfer rate up to 6Gb/s
  • Integrated Advanced Host Controller Interface (AHCI) controller
  •  
     
    IDE INTERFACE
  • Supports up to two IDE devices
  • DMA mode: Ultra ATA up to 100MB/s
  • PIO mode: up to 16MB/s
  •  
     
    DAMAGE FREE INTELLIGENCE
  • Monitors CPU temperature and overheat alarm
  • Monitors CPU fan speed and failure alarm
  • Monitors Vcore/VGFX/1.5V voltages and failure alarm
  • Watchdog timer function
  •  
     
    EXPANSION INTERFACES
  • Supports 8 USB ports (USB 1.1/2.0 host controllers)
  • Supports 4 PCI slots (PCI 2.3 interface)
  • Supports PCIe x16/SDVO/HDMI/Display Port switchable interface
    - Uses QM67's DDI (Digital Display Interface) Port B for SDVO/HDMI
       and DDI Port C for Display Port/HDMI
    - VBIOS default setting at Port C only; VBIOS settings modified
       upon request
  • Supports 1 PCIe x16 interface
    - Supports Gen 3.0 (3rd generation processors)
    - Supports Gen 2.0 (2nd generation processors)
  • Supports 5 PCIe x1 interfaces
  • Supports LPC interface
  • Supports SMBus interface
  • Supports IDE interface
  • Supports 8-bit Digital I/O
  •  
     
    BIOS
  • 64Mbit UEFI SPI BIOS
  •  
     
    POWER CONSUMPTION
  • 54.70 W with i7-2710QE at 2.10GHz and 2x 4GB DDR3 SODIMM
  •  
     
    OS SUPPORT
  • Windows XP Professional x86 & SP3 (32-bit)
  • Windows XP Professional x64 & SP2 (64-bit)
  • Windows 7 Ultimate x86 & SP1 (32-bit)
  • Windows 7 Ultimate x64 & SP1 (64-bit)
  • Windows 8 Enterprise x86 (32-bit)
  • Windows 8 Enterprise x64 (64-bit)
  •  
     
    TEMPERATURE
  • 0oC to 60oC
  •  
     
    HUMIDITY
  • 10% to 90%
  •  
     
    POWER
  • Input: 12V, 5VSB (optional), VCC_RTC
  •  
     
    PCB
  • Dimensions
     - COM Express® Basic
     - 95mm (3.74") x 125mm (4.9")
  • Compliance
     - PICMG COM Express® R1.0, Type 2
  •  
     
    CERTIFICATIONS
  • CE
  • FCC Class B
  • UL
  • RoHS
  •  
     
    PACKING LIST
  • 1 HR900-B board
  • 1 QR (Quick Reference)
  • 1 Drivers/utilities disk
  •  
     
    Optional Items
  • COM630-B carrier board kit
  • Heat spreader: TBD
  • Heat sink with fan: A71-111009-001G
  • Heat spreader with heat sink and fan: TBD
  •  
    *Optional and is not supported in standard model. Please contact your sales representative for more information.
    DFI reserves the right to change the specifications at any time prior to the product's release. Please contact your sales representative for the exact revision offered in your area.


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